Technology · Conference

37th Annual Electronics Packaging Symposium- Small Systems Integration

Name: 37th Annual Electronics Packaging Symposium- Small Systems Integration
Start: 2026-09-09
End: 2026-09-09
Location: Binghamton University

The 37th annual symposium on electronics packaging at Binghamton University.

Wed, 9 Sep 2026 Binghamton University Binghamton , New York

Binghamton University is proud to host the 37th Annual Electronics Packaging Symposium on September 9, 2026. This year's theme, Small Systems Integration, brings together industry experts, researchers, and students to discuss the latest advancements in electronics packaging technology. Held at the Center of Excellence in Vestal, New York, this symposium is a premier event for professionals in the field. Register now to participate in this significant industry gathering and explore the future of electronics integration.

What to Expect

A professional conference featuring technical presentations and industry discussions.

Who Should Attend

Engineers
Researchers
Industry professionals
Students

Agenda Overview

The symposium takes place on September 9, 2026.

Venue & Address

Binghamton University

4400 Vestal Pkwy E
Binghamton , New York – 13902
United States

Organizer

Binghamton University · University

Binghamton University is a leading research institution hosting various academic and industry conferences.

Frequently Asked Questions

Where is the symposium?

Binghamton University, Center of Excellence, Vestal, NY.

What is the theme?

Small Systems Integration.

How do I register?

Check the university's symposium website.

Who should attend?

Professionals in electronics packaging.

Is it recurring?

Yes, this is the 37th annual event.

What is the date?

September 9, 2026.